Launch of TRENG-PLP Coater: Panel Level Coater for Advanced Semiconductor Packaging [Yahoo! Finance]
TORAY INDUS INC UNSP/ADR (TRYIY)
NASDAQ:AMEX Investor Relations:
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Source: Yahoo! Finance
Engineering") has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging (hereinafter "PLP"); PLP is an advanced semiconductor packaging technology, for which there is growing demand particularly from AI servers and data centers. Sales of the TRENG-PLP Coater will commence in December 2024. The Coater enables 2.5D packaging-a next-generation semiconductor production technology-to be applied to larger substrates. Specifically, it is capable of creating detailed rewiring layers on glass substrates for use in interposers, which are a key component of integrated circuits. In this way, the Coater facilitates the production of high-performance semiconductors. Toray Engineering has already delivered pilot TRENG-PLP Coaters to a number of major semiconductor manufacturers to demonstrate its capabilities. Now, the company is preparing to mass-produce the devices, and is targeting orders totaling 20 million USD by fiscal 2025, and 40 million USD by fiscal 2
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