Resonac Develops Temporary Bonding Film and New Debonding Process for Advanced Semiconductor Packages
RESONAC HOLDINGS CP U/ADR (SHWDY)
NASDAQ:AMEX Investor Relations:
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Company Research
Source: Business Wire
Achieving Cleanliness and High Productivity through New Technology TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass carrier temporarily in the semiconductor device fabrication process (front-end process) and semiconductor packaging process (back-end process), as well as its debonding process. This debonding process uses xenon (Xe) flash light irradiation to debond the wafer or package from the carrier and can be applied from wafer level to panel level processing. It also should be noted that Debonding is completed in a shorter time as compared to the conventional laser ablation method without producing foreign substances such as soot. This technology has been patented in Japan, the United States, Korea, China, and Taiwan region.*This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/202
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