Valeo and ROHM Semiconductor Co-develop Next-generation Power Electronics [Yahoo! Finance]
ROHM CO LTD UNSP/ADR (ROHCY)
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Source: Yahoo! Finance
company of ROHM Co., Ltd., a leading semiconductor/electronic component manufacturer in Japan , will provide its 2-in-1 silicon carbide (SiC) molded module, the TRCDRIVE pack (TM), to Valeo S.A., a Paris -based leading automotive technology company, for future powertrain solutions. This is their first step toward collaboration to optimize the next generation of power modules for electric motor inverters using their combined expertise in power electronics management. Valeo is broadening access to efficient, electrified mobility across various vehicle types and markets from the smallest one (e-bikes), through the mainstream (passenger cars) to the biggest one (e-trucks). By combining Valeo's expertise in mechatronics, thermal management and software development with ROHM's power modules, Valeo drives the power electronics solution forward, contributing to the performance, efficiency, and decarbonization of automotive systems worldwide. Both companies have been collaborating since 20
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News
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- ROHM’s EcoSiC Technology Adopted in COSEL’s HFA/HCA Series 3.5kW Output AC-DC Power Supply UnitsGlobeNewswire
- ROHM Semiconductor and Valeo Co-Develop the Next Generation of Power Electronics [Yahoo! Finance]Yahoo! Finance