Renesas Electronics Enables Rapid and Seamless Out-of-Box Cloud Connectivity Using Microsoft Azure RTOS
RENESAS ELECTRON UNSP/ADR (RNECY)
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Source: Business Wire
Renesas Synergy and RX Microcontroller Kits Leverage Azure RTOS and a Variety of Additional Microsoft Azure IoT Building Blocks to Streamline Device-to-Cloud Design Experiences TOKYO--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, deepened its collaboration with Microsoft to offer seamless device-to-cloud experience for IoT developers. In October 2019, the two companies began a collaboration to deliver a complete chip-to-cloud IoT solution based on Renesas’ microcontroller (MCU) and microprocessor (MPU) devices and Microsoft Azure IoT building blocks, including Azure RTOS, Azure IoT device SDK for C, IoT Plug and Play, IoT Central and IoT Hub.“Our Synergy and RX cloud kits combined with Azure RTOS and other Azure IoT building blocks offer MCU customers a quick and secure end-to-end solution for cloud connectivity,” said Sailesh Chittipeddi, Executive Vice President, General Manager IoT and Infrastructure Business
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