Nano Dimension’s Additive Electronics Product Line - Essemtec - Received a Global Technology Award
Nano Dimension Ltd. - American Depositary Shares (NNDM)
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Source: GlobeNewswire
The Tarantula Underfill System Recognized at SMTA International 2024 Show in Chicago Waltham, Mass., Dec. 11, 2024 (GLOBE NEWSWIRE) -- Nano Dimension Ltd. (Nasdaq: NNDM) (“Nano Dimension” or the “Company”), a leading supplier of Additively Manufactured Electronics (“AME”) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (“AM”) 3D printing solutions, today announced that its Tarantula Underfill system from its Essemtec product lines received the Global Technology Award for Innovation at the SMTA International 2024 Show (the “SMTA Show”) in Chicago, Illinois. Essemtec’s Tarantula Underfill system is critical in the additive electronics value chain for assembly of complex devices. It involves dispensing an epoxy-based composite along the edge of a chip, which fills the gap between the chip and the substrate, or printed circuit boards, through capillary action. This innovation enhances mechanical strength by reducing stresses caused by thermal expansion and vibr
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- Desktop Metal Files Lawsuit Against Nano Dimension for Breach of Merger Agreement [Yahoo! Finance]Yahoo! Finance
- Nano Dimension Announces Changes in Board Composition [Yahoo! Finance]Yahoo! Finance
- Nano Dimension Announces Changes in Board CompositionGlobeNewswire
- Nano Dimension's Additive Electronics Product Line - Essemtec - Received a Global Technology Award [Yahoo! Finance]Yahoo! Finance
- Nano Dimension Shareholders Overwhelmingly Support Murchinson's Nominees at 2024 Annual General Meeting [Yahoo! Finance]Yahoo! Finance
NNDM
Sec Filings
- 12/18/24 - Form 144
- 12/16/24 - Form 6-K
- 12/10/24 - Form 144
- NNDM's page on the SEC website