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IIT Prints 3D Embedded Sensors in Electrical Packaging for Next Generation MEMS Devices Using Nano Dimension’s DragonFly System

Nano Dimension Ltd. - American Depositary Shares  (NNDM) 
US:NASDAQ Investor Relations: investors.nano-di.com
PDF Istituto Italiano di Technologia plans to use the packaging for rapid device and microsystem prototyping of micro-electro-mechanical systems and wearable transducers [Read more]