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Stock impact report

Fan-Out Wafer Level Packaging Market size is set to grow by USD 5.52 billion from 2024-2028, increased demand for compactly designed electronics to boost the market growth, Technavio [Yaho...

Nordson Corporation (NDSN) 
Last nordson corporation earnings: 2/19 04:30 pm Check Earnings Report
US:NASDAQ Investor Relations: nordson.com/en/our-company/investors
Company Research Source: Yahoo! Finance
The market is estimated to grow at a CAGR of over 23.77% during the forecast period. Increased demand for compactly designed electronics is driving market growth, with a trend towards increasing adoption of semiconductor ics in automobiles. However, increased production costs because of warpage poses a challenge. Key market players include Amkor Technology Inc., ASE Technology Holding Co. Ltd., Deca Technologies Inc., Infineon Technologies AG, Jiangsu Changdian Technology Co. Ltd., nepes Corp., Nordson Corp., NXP Semiconductors NV, Onto Innovation Inc., Panasonic Holdings Corp., Powertech Technology Inc., Renesas Electronics Corp., Singapore Semiconductor Industry Association, SUSS MICROTEC SE, Taiwan Semiconductor Manufacturing Co. Ltd., Unisem M Berhad, UTAC Holdings Ltd., Winbond Electronics Corp., Yield Engineering Systems, and Yole Developpement SA. Get a detailed analysis on regions, market segments, customer landscape, and companies - Click for the snapshot of this report F Show less Read more
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