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-0.0235919234856535 -0.042720510095643 -0.0225292242295431 0.00828905419766207 -0.022316684378321 -0.022316684378321 -0.0335812964930926 -0.0376195536663125
Stock impact report

Kulicke & Soffa and ROHM Semiconductor Develop New CuFirst™ Hybrid Bonding Process

Kulicke and Soffa Industries, Inc. (KLIC) 
Last kulicke and soffa industries, inc. earnings: 4/29 10:00 pm Check Earnings Report
US:NASDAQ Investor Relations: kns.com
Company Research Source: PR Newswire
SINGAPORE, Nov. 13, 2024 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company"), in collaboration with ROHM Co., Ltd (TYO: 6963) ("ROHM"), a producer of a wide-range of semiconductor devices, announces a new path to hybrid bonding leveraging Kulicke & Soffa's leading Fluxless Thermo-Compression (FTC) process.Kulicke & Soffa's recently released APTURA™ FTC system, combined with technology innovations from ROHM, have successfully enhanced chip-to-wafer hybrid bonding with the innovative copper-first – CuFirst™ – hybrid solution. While existing die-to-wafer hybrid bonding capacity can enable significant I/O density – yield challenges, cost of ownership, and front-end processing requirements are limiting the adoption rate and market potential of existing hybrid solutions.The CuFirst hybrid solution, utilizing the K&S APTURA FTC platform, addresses these production limitations and challenges. With the emerging CuFirst process, th Show less Read more
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