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0 0.0010622477161675 0 -0.00244316974718493 -0.00361164223496908 -0.00339919269173564 -0.00063734862970047 -0.00063734862970047
Stock impact report

Die Bonder Equipment Market size is set to grow by USD 189.1 million from 2024-2028, Rising electronics production across the world boost the market, Technavio [Yahoo! Finance]

Kulicke and Soffa Industries, Inc. (KLIC) 
Last kulicke and soffa industries, inc. earnings: 4/29 10:00 pm Check Earnings Report
US:NASDAQ Investor Relations: kns.com
Company Research Source: Yahoo! Finance
The market is estimated to grow at a CAGR of almost 4.07% during the forecast period. Rising electronics production across the world is driving market growth, with a trend towards increase in number of osat vendors. However, cyclical nature of semiconductor industry poses a challenge. Key market players include ASMPT Ltd., BE Semiconductor Industries NV, DIAS Automation HK Ltd., Dr. Tresky AG, ficonTEC Service GmbH, Finetech GmbH and Co. KG, Four Technos Co. Ltd., HYBOND Inc., Indubond, Kulicke and Soffa Industries Inc., MicroAssembly Technologies Ltd., Mycronic AB, Palomar Technologies Inc., Panasonic Holdings Corp., Paroteq GmbH, SHIBAURA MECHATRONICS CORP., SHIBUYA Corp., UniTemp GmbH, WestBond Inc., and Yamaha Motor Co. Ltd.. Get a detailed analysis on regions, market segments, customer landscape, and companies- View the snapshot of this report Die Bonder Equipment Market Scope Report Coverage Details Base year Historic period Forecast period Growth momentum & CAGR Show less Read more
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