Accelsius Secures $24M in Series A Funding to Efficiently Cool AI Data Centers
Innventure, Inc. (INV)
Company Research
Source: Business Wire
Funding will help enable Accelsius to keep up with increasing demand for its proprietary NeuCool two-phase, direct-to-chip liquid cooling systemNeuCool enables over 10 times today’s rack power densities with an estimated 40%-50% savings in data center cooling energy compared to conventional cooling methods, with zero water consumedPlans include international expansion, new innovative liquid cooling solutions and accelerated hiring across engineering, R&D, sales, marketing, manufacturing and operations AUSTIN, Texas--(BUSINESS WIRE)--Accelsius™, whose proprietary two-phase, direct-to-chip liquid cooling systems enable high-performance computing and rack density for data center and edge operators, announced today the successful raise of $24 million pursuant to a Series A funding round. The Series A funding round started in early 2024.“This investment is a testament to our team’s intense focus on operational innovation and technological ingenuity,” said Josh Claman, Accelsius’ CEO. “W
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News
- Accelsius and iM Data Centers Partner to Bring Sustainable, High-Performance Cooling Solutions to Miami Data Center [Yahoo! Finance]Yahoo! Finance
- Accelsius and iM Data Centers Partner to Bring Sustainable, High-Performance Cooling Solutions to Miami Data CenterBusiness Wire
- Innventure Reports Third Quarter 2024 Results [Yahoo! Finance]Yahoo! Finance
- Innventure Reports Third Quarter 2024 ResultsGlobeNewswire
- AeroFlexx Delivering Innovative Packaging to Meet Rising Demand for Sustainable Liquid Packaging SolutionsPR Newswire
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Sec Filings
- 11/19/24 - Form 424B3
- 11/19/24 - Form 424B3
- 11/18/24 - Form 8-K
- INV's page on the SEC website