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0 0 -0.00170948765649348 -0.00170948765649348 0.00055306953592452 0.00055306953592452 0.00055306953592452 0.00055306953592452
Stock impact report

Semiconductor Advanced Packaging Market to Grow by USD 22.79 Billion (2024-2028), Driven by Complex IC Designs, with AI Shaping Market Trends - Technavio [Yahoo! Finance]

ChipMOS TECHNOLOGIES INC. - American Depositary Shares (IMOS) 
Last chipmos technologies inc. - american depositary shares earnings: 11/9 01:00 am Check Earnings Report
US:NASDAQ Investor Relations: nasdaq.com/symbol/imos
Company Research Source: Yahoo! Finance
estimated to grow by USD 22.79 billion from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of over 8.72% during the forecast period. Complex semiconductor ic designs is driving market growth, with a trend towards integration of semiconductor components in vehicles. However, increased production costs poses a challenge. Key market players include Amkor Technology Inc., ASE Technology Holding Co. Ltd., Cactus Materials Inc., China Wafer Level CSP Co. Ltd., ChipMOS TECHNOLOGIES INC., HANA Micron Co. Ltd., Intel Corp., Jiangsu Changdian Technology Co. Ltd., King Yuan Electronics Co. Ltd., Microchip Technology Inc., nepes Corp., Powertech Technology Inc., Renesas Electronics Corp., Samsung Electronics Co. Ltd., SIGNETICS Corp., Taiwan Semiconductor Manufacturing Co. Ltd., Tongfu Microelectronics Co. Ltd., Toshiba Corp., UTAC Holdings Ltd., and Veeco Instruments Inc.. Key insights into market evolution with AI-powered analysis. Explore trends, segmentation, a Show less Read more
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