Infineon and pmdtechnologies Collaborate With Qualcomm to Enable High-Quality Standard Solution for 3D Authentication
INFINEON TECHS AG S/ADR (IFNNY)
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infineon.com/cms/en/about-infineon/investor
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Source: Business Wire
MUNICH--(BUSINESS WIRE)--Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) worked with Qualcomm Technologies, Inc. to develop a reference design for 3D authentication based on the Qualcomm® Snapdragon™ 865 Mobile Platform. Infineon is thus extending its application portfolio of its 3D sensor technology for mobile devices. The reference design uses the REAL3™ 3D Time-of-Flight (ToF) sensor and enables a standardized, cost-effective and easy-to-design integration for smartphone manufacturers. Infineon and pmd have been successfully active with its 3D ToF sensor technology in the mobile device market for four years. Already at the CES 2020 in Las Vegas, the two companies introduced the world’s smallest (4.4 mm x 5.1 mm) yet most powerful 3D image sensor with VGA resolution. It meets highest requirements for face authentication, enhanced photo features and authentic augmented reality experiences.This press release features multimedia. View the full release here: https://www.businessw
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