Alpha and Omega Semiconductor Adds Two New Advanced MOSFET Package Options for High-Current Applications
Alpha and Omega Semiconductor Limited - Common Shares (AOSL)
Last alpha and omega semiconductor limited - common shares earnings: 2/5 04:05 pm
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Source: Business Wire
The state-of-the-art topside cooling (GTPAK™) and gull-wing (GLPAK™) packages meet increased performance and robust environmental demands SUNNYVALE, Calif.--(BUSINESS WIRE)--Alpha and Omega Semiconductor Limited (AOS) (Nasdaq: AOSL), a designer, developer, and global supplier of a broad range of discrete power devices, wide band gap power devices, power management ICs, and modules, today announced the release of two state-of-the-art surface mounting package options for its industry-leading high power MOSFET portfolio. Designed to meet the robust packaging requirements for the most demanding applications that require increased performance and reliability, the new GTPAK™ and GLPAK™ packages will first be available on AOS’ AOGT66909 and AOGL66901 MOSFETs respectively. Combining AOS-proven robust MOSFET technology with advanced packaging know-how, these devices provide low ohmic and high current capabilities, critical to reducing the number of parallel MOSFETs needed in high current de
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AOSL
Earnings
- 11/5/25 - Beat
AOSL
Sec Filings
- 12/16/25 - Form 4
- 12/16/25 - Form 4
- 12/15/25 - Form 144
- AOSL's page on the SEC website