Applied Materials Announces New Collaboration Model for Advanced Packaging at Summit on Energy-Efficient Computing
Applied Materials, Inc. (AMAT)
Last applied materials, inc. earnings: 2/12 04:01 pm
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Source: GlobeNewswire
EPIC Advanced Packaging marks an expansion of Applied’s global innovation platformCompany convenes top semiconductor R&D leaders to advance high-performance, low-power AI chip packaging technologies SANTA CLARA, Calif. and SINGAPORE, Nov. 18, 2024 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced plans to expand its global EPIC* innovation platform with a new collaboration model specifically designed to accelerate commercialization of advanced chip packaging technologies. To kick-off the initiative, Applied convened more than two dozen top R&D leaders from the semiconductor industry to encourage alliances between equipment makers, material providers, device companies and research institutes. The goal is to fast-track new technologies for the next generation of energy-efficient computing. Applied hosted the summit in Singapore, where the company has been collaborating on advanced packaging R&D with its customers and partners for over a decade. The dramatic rise in the num
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AMAT
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- 11/14/24 - Beat
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- 10/3/24 - Form 4
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