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Stock impact report

ACM Research Expands Fan-Out Panel-Level Packaging Portfolio with Launch of Ultra C bev-p Bevel Etching Tool

ACM Research, Inc. - Class A (ACMR) 
Last acm research, inc. - class a earnings: 3/18 04:10 pm Check Earnings Report
US:NASDAQ Investor Relations: ir.acmrcsh.com
Company Research Source: GlobeNewswire
New double-sided bevel etching system enhances process efficiency and reliability in copper-related applications, supporting high-precision features on large panels FREMONT, Calif., Sept. 03, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging applications, today announced the launch of its Ultra C bev-p panel bevel etching tool for fan-out panel-level packaging (FOPLP) applications. The new tool is specifically designed for bevel etching and cleaning in copper-related processes and is capable of handling both the front and back sides of panel bevel etching within a single system. This capability enhances process efficiency and product reliability. “We believe FOPLP will gain prominence as it meets the evolving demands of modern electronic applications, offering advantages in integration density, cost efficiency and design flexibility,” said Dr. David Wang, ACM’s pre Show less Read more
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