0.000462641684015747 -0.000771069473359506 0.000231320842007874 0.000771069473359506 -0.00223610147274263 0.00084817642069561 0.00516616547150911 0.00308427789343824
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Stockreport

Huawei and Wuhan Xinxin to develop high-bandwidth memory chips amid US restrictions [Yahoo! Finance]

Micron Technology, Inc. (MU)  More Company Research Source: Yahoo! Finance
Last micron technology, inc. earnings: 3/25 04:01 pm Check Earnings Report
US:NASDAQ Investor Relations: investors.micron.com
to sources, as these devices have become an indispensable component in the computing infrastructure used for artificial intelligenc e (AI) projects. This initiative also involves mainland integrated circuit (IC) packaging firms Jiangsu Changjiang Electronics Tech and Tongfu Microelectronics, which are tasked to provide the so-called Chip on Wafer on Substrate - an advanced packaging technology for stacking different types of semiconductors, such as graphics processing units (GPUs) and HBM chips, on a single package, the sources said. Neither Huawei nor Wuhan Xinxin immediately replied to requests for comment on Sunday. Do you have questions about the biggest topics and trends from around the world? Get the answers with SCMP Knowledge , our new platform of curated content with explainers, FAQs, analyses and infographics brought to you by our award-winning team. US-blacklisted Huawei's move into the HBM chip space would mark its latest effort to defy Washington's tech sanctions [Read more]

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Stockreport

Huawei and Wuhan Xinxin to develop high-bandwidth memory chips amid US restrictions [Yahoo! Finance]

Micron Technology, Inc.  (MU) 
Last micron technology, inc. earnings: 3/25 04:01 pm Check Earnings Report
US:NASDAQ Investor Relations: investors.micron.com
to sources, as these devices have become an indispensable component in the computing infrastructure used for artificial intelligenc e (AI) projects. This initiative also involves mainland integrated circuit (IC) packaging firms Jiangsu Changjiang Electronics Tech and Tongfu Microelectronics, which are tasked to provide the so-called Chip on Wafer on Substrate - an advanced packaging technology for stacking different types of semiconductors, such as graphics processing units (GPUs) and HBM chips, on a single package, the sources said. Neither Huawei nor Wuhan Xinxin immediately replied to requests for comment on Sunday. Do you have questions about the biggest topics and trends from around the world? Get the answers with SCMP Knowledge , our new platform of curated content with explainers, FAQs, analyses and infographics brought to you by our award-winning team. US-blacklisted Huawei's move into the HBM chip space would mark its latest effort to defy Washington's tech sanctions [Read more]

IMPACT SNAPSHOT
EVENT TIME:
MU
Last Price
Price Change
Price Change %
Volume Shares
Max Up
Max Down
Volume Ratio
%
Don't Miss Out On The Next BIG Stock Move
Performance comparison Updated
EVENT DAY
Stock performance from the time of news release until the following 4pm ET market close
LAST PRICE AT
NEWS EVENT
SINCE EVENT
Multi-day stock performance from the time of the news release
LAST PRICE
VWAP
High:
MAX UP
High:
Low:
MAX DOWN
Low:
%
POST NEWS RANGE
%
PRICE CHANGE

PRICE CHANGE PERCENTAGE


S&P 500 (SPX)

%

VOLUME RATIO
%

VOLUME (SHARES)
TICKS

AVG SHARES PER TRADE

EVENT DAY
Event Day Chart will not be displayed beyond 90-day period of the event
PERFORMANCE SINCE EVENT
TIME AND VELOCITY ANALYSIS