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Micron Samples the Industry’s First uMCP Product With LPDDR5 to Increase Performance and Battery Life in 5G Smartphones

Micron Technology, Inc. (MU)  More Company Research Source: GlobeNewswire
Last micron technology, inc. earnings: 3/25 04:01 pm Check Earnings Report
US:NASDAQ Investor Relations: investors.micron.com
SAN JOSE, Calif., March 10, 2020 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today announced it began sampling the industry’s first universal flash storage (UFS) multichip package (uMCP) with low-power DDR5 (LPDDR5) DRAM. The uMCP provides high-density and low-power storage designed to fit on slim and compact midrange smartphone designs. Micron’s new uMCP5 packaging builds on the company’s innovation and leadership in multichip form factors. Micron uMCPs combine low-power DRAM with NAND and an onboard controller, using 40% less space compared to a two-chip solution. This optimized configuration saves power, reduces memory footprint and enables smaller and more agile smartphone designs. “Featuring the latest LPDRAM and UFS interface, this first-in-the-industry packaging solution offers a 50% increase in memory and storage bandwidth while reducing power,” said Dr. Raj Talluri senior vice president and general manager at Micron.  “Our new uMCP5 package enables midrange [Read more]

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Micron Samples the Industry’s First uMCP Product With LPDDR5 to Increase Performance and Battery Life in 5G Smartphones

Micron Technology, Inc.  (MU) 
Last micron technology, inc. earnings: 3/25 04:01 pm Check Earnings Report
US:NASDAQ Investor Relations: investors.micron.com
SAN JOSE, Calif., March 10, 2020 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU), today announced it began sampling the industry’s first universal flash storage (UFS) multichip package (uMCP) with low-power DDR5 (LPDDR5) DRAM. The uMCP provides high-density and low-power storage designed to fit on slim and compact midrange smartphone designs. Micron’s new uMCP5 packaging builds on the company’s innovation and leadership in multichip form factors. Micron uMCPs combine low-power DRAM with NAND and an onboard controller, using 40% less space compared to a two-chip solution. This optimized configuration saves power, reduces memory footprint and enables smaller and more agile smartphone designs. “Featuring the latest LPDRAM and UFS interface, this first-in-the-industry packaging solution offers a 50% increase in memory and storage bandwidth while reducing power,” said Dr. Raj Talluri senior vice president and general manager at Micron.  “Our new uMCP5 package enables midrange [Read more]

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MU
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LAST PRICE AT
NEWS EVENT
SINCE EVENT
Multi-day stock performance from the time of the news release
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Low:
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Low:
%
POST NEWS RANGE
%
PRICE CHANGE

PRICE CHANGE PERCENTAGE


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%

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TICKS

AVG SHARES PER TRADE

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