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Stockreport

Applied Materials Announces a Strategic Investment in BE Semiconductor Industries

Applied Materials, Inc. (AMAT)  More Company Research Source: GlobeNewswire
Last applied materials, inc. earnings: 2/12 04:01 pm Check Earnings Report
US:NASDAQ Investor Relations: appliedmaterials.com/company/investor-relations
SANTA CLARA, Calif., April 14, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has purchased 9 percent of the outstanding shares of the common stock of BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry. Applied and Besi have been successfully collaborating since 2020, and recently extended their agreement, to co-develop the industry’s first fully integrated equipment solution for die-based hybrid bonding. Hybrid bonding is becoming a critical technology for advanced packaging of semiconductors as designers and manufacturers race to develop more energy-efficient chips. Hybrid bonding connects chips using direct copper-to-copper bonds, which increases density and shortens the lengths of interconnect wiring between chiplets, resulting in improved overall performance, power consumption and cost. “We view this as a strategic, long-term investment that demonstrates Applied Materials’ commitment to co- [Read more]
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Stockreport

Applied Materials Announces a Strategic Investment in BE Semiconductor Industries

Applied Materials, Inc.  (AMAT) 
More Company Research Source: GlobeNewswire
Last applied materials, inc. earnings: 2/12 04:01 pm Check Earnings Report
US:NASDAQ Investor Relations: appliedmaterials.com/company/investor-relations
SANTA CLARA, Calif., April 14, 2025 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced it has purchased 9 percent of the outstanding shares of the common stock of BE Semiconductor Industries N.V. (Besi), a leading manufacturer of assembly equipment for the semiconductor industry. Applied and Besi have been successfully collaborating since 2020, and recently extended their agreement, to co-develop the industry’s first fully integrated equipment solution for die-based hybrid bonding. Hybrid bonding is becoming a critical technology for advanced packaging of semiconductors as designers and manufacturers race to develop more energy-efficient chips. Hybrid bonding connects chips using direct copper-to-copper bonds, which increases density and shortens the lengths of interconnect wiring between chiplets, resulting in improved overall performance, power consumption and cost. “We view this as a strategic, long-term investment that demonstrates Applied Materials’ commitment to co- [Read more]
IMPACT SNAPSHOT
EVENT TIME:
AMAT
Last Price
Price Change
Price Change %
Volume Shares
Max Up
Max Down
Volume Ratio
%
Don't Miss Out On The Next BIG Stock Move
Performance comparison Updated
EVENT DAY
Stock performance from the time of news release until the following 4pm ET market close
LAST PRICE AT
NEWS EVENT
SINCE EVENT
Multi-day stock performance from the time of the news release
LAST PRICE
VWAP
High:
MAX UP
High:
Low:
MAX DOWN
Low:
%
 POST NEWS RANGE
%
PRICE CHANGE
PRICE CHANGE PERCENTAGE
S&P 500 (SPX)
%
 VOLUME RATIO
%
VOLUME (SHARES)
TICKS
AVG SHARES PER TRADE
EVENT DAY
Event Day Chart will not be displayed beyond 90-day period of the event
PERFORMANCE SINCE EVENT
TIME AND VELOCITY ANALYSIS